EVG40 D2W post-bond overlay metrology
EV Group · Warpage, topography and stress metrology
- Purpose
- Map post-bond die-to-wafer overlay errors to compare placement distributions and process feedback.
- Technical approach
- Optics/image processing measure marks using dual-focus, infrared or side-by-side configurations and generate overlay-model parameters.
- Scope of use
- For post-bond D2W structures in heterogeneous integration and advanced packaging, subject to mark layout and optical access.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsBuried marks are not universally visible. Acceptable overlay does not prove Cu continuity, bond strength or absence of voids; specifications may not apply simultaneously.
What to prepareBLNKK suggests preparing mark designs, die maps, stacks, before/after positions and process history, with repeatability, coverage and independent bond-quality comparisons.
Confirm with the supplierConfirm optical access, dual-focus/IR configuration, accuracy, throughput, model outputs and data export. Agree how feedback reaches existing bonding equipment.
- Public evidence
- The official page and flyer describe post-bond measurement and full-die inspection capability; actual coverage and speed remain configuration-dependent.
Supporting references
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.