Temporary bonding and low-stress debonding for thin wafers
Thin and reconstituted wafers need mechanical support during thinning, backside processing and transfer to manage warpage and breakage risk.
EV Group
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- Wafer bonding · lithography · temporary bond and debond
Applications: Thin wafers, FoWLP and 3D integration · 3D IC, memory stacking, BSI CIS and hybrid bonding · chiplet / 3D IC / heterogeneous integration · Die-to-wafer alignment · Fan-out redistribution lithography
Catalog solutions · 5
GEMINI FB XT 300 mm fusion and hybrid wafer bonding
3D IC and memory stacking require controlled wafer cleaning, activation and alignment to establish suitable interfaces and interconnects for fusion or hybrid bonding.
EVG 320 D2W cleaning and surface activation for hybrid bonding
Particles, surface chemistry and the interval between cleaning and bonding can affect die-to-wafer hybrid bonding. Die preparation needs to be assessed alongside the downstream placement flow.
EVG40 D2W post-bond overlay metrology
Map post-bond die-to-wafer overlay errors to compare placement distributions and process feedback.
LITHOSCALE die-shift-compensating exposure
Fan-out die movement requires matching subsequent RDL exposure patterns to actual positions and verifying alignment.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Hybrid-bonding equipment and integration solutions · Local interface voids after hybrid bonding →
- LITHOSCALE die-shift-compensating exposure · Post-mold die shift and RDL misalignment in fan-out packages →
- Temporary bonding and low-stress debonding for thin wafers · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- Assessment of EVG post-bond position measurement · Pad misalignment and electrical opens after hybrid bonding →
- EVG40 D2W post-bond overlay metrology · Pad misalignment and electrical opens after hybrid bonding →
- EVG40 D2W post-bond overlay metrology · Pad misalignment and electrical opens after hybrid bonding →
- GEMINI FB XT 300 mm fusion and hybrid wafer bonding · Pad misalignment and electrical opens after hybrid bonding →
- Assessment of EVG cleaning/activation process comparisons · Pre-bond surface readiness and release for hybrid bonding →
- EVG 320 D2W cleaning and surface activation for hybrid bonding · Pre-bond surface readiness and release for hybrid bonding →
- Assess integrated EVG debonding, support, and cleaning · Temporary-bond residue and cleaning compatibility →
Public sources
- Product information: Temporary bonding and low-stress debonding for thin wafers
- Technical reference: EVG temporary bonding and debonding solutions (V25/01) (PDF)
- Product information: GEMINI FB XT 300 mm fusion and hybrid wafer bonding
- Technical reference: Leti 300-mm, 1-µm-pitch hybrid-bonding research demonstration, November 2017
- Product information: EVG 320 D2W cleaning and surface activation for hybrid bonding
- Technical reference: EVG 320 D2W product flyer (V26/01) (PDF)
- Product information: EVG40 D2W post-bond overlay metrology
- Product information: LITHOSCALE die-shift-compensating exposure
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office · Sales inquiries
EV Group Inc. — North America Sales
- Phone
- +1 480 305 2400
Official source ↗Source checked
Taiwan · General contact · Sales inquiries
EVG-JOINTECH CORP. — Taiwan Sales
- Phone
- +886 3 516 3389
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
EV Group China Ltd. — Shanghai Sales
- Sales@EVGroup.cn
- Phone
- +86 21 3899 4888
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier office · Technical support
EV Group Taiwan Ltd. — Technical Support
- Phone
- +886 3 566 7900
Official source ↗Source checked
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