LITHOSCALE die-shift-compensating exposure

EV Group · Process equipment and thermal control

Purpose: Fan-out die movement requires matching subsequent RDL exposure patterns to actual positions and verifying alignment.
Technical approach: LITHOSCALE performs digital maskless exposure. Die-level compensation combines external position metrology, layout processing and tool alignment to generate corrected patterns.
Scope of use: Wafer-level redistribution processes with usable marks and die-position data, after validating resist, substrate and pattern-conversion workflows.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Compensation does not prevent molding shifts or repair existing opens. The described die-shift workflow excludes thermal influences; traceability annotation does not prove corrected overlay.
What to prepare
BLNKK suggests documenting shift maps, mark quality, RDL layouts/correction rules and resist/process conditions, with post-exposure alignment checks.
Confirm with the supplier
Confirm metrology/layout interfaces, correction modes, substrate/mark requirements and the resist-specific process window. Discuss thermal deformation separately.
Public evidence: EVG’s product page and January 2024 paper describe alignment/distortion functions and explicitly require external metrology for die-level compensation and rerouting.

Supporting references

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