GEMINI FB XT 300 mm fusion and hybrid wafer bonding
EV Group · Process equipment and thermal control
- Purpose
- 3D IC and memory stacking require controlled wafer cleaning, activation and alignment to establish suitable interfaces and interconnects for fusion or hybrid bonding.
- Technical approach
- GEMINI FB XT integrates cleaning, LowTemp plasma activation, face-to-face alignment and bonding on an automated platform, with configurable alignment-verification and debond modules. The 300-mm configuration uses SmartView NT3.
- Scope of use
- EVG lists wafer-to-wafer memory stacking, 3D SoC, BSI CMOS image sensors and die partitioning. Verify configurations separately: 300 mm uses NT3; 200 mm uses NT2.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsEquipment alignment does not guarantee post-bond overlay, interconnect yield or reliability. The 2017 result is a research demonstration; EVG also ties specifications to configuration, process and materials.
What to prepareBring wafer size, bonding interface/pitch, surface and bow measurements, upstream/downstream flow, and overlay, defect and throughput targets to discuss configuration and trials.
Confirm with the supplierConfirm NT2/NT3 configurations, alignment measurement definitions, preparation/verification modules and post-bond acceptance methods. Agree on wafer trials, process-window assessment and throughput evaluation.
- Public evidence
- Current equipment data specify sub-50-nm alignment for NT3. Leti's 2017 research demonstration of 300-mm, 1-µm-pitch hybrid bonding used the earlier SmartView NT, so it does not validate the current configuration's performance.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.