EVG 320 D2W cleaning and surface activation for hybrid bonding
EV Group · Process equipment and thermal control
- Purpose
- Particles, surface chemistry and the interval between cleaning and bonding can affect die-to-wafer hybrid bonding. Die preparation needs to be assessed alongside the downstream placement flow.
- Technical approach
- EVG 320 D2W combines die cleaning and plasma activation with automated carrier handling for direct-placement D2W flows. It can operate independently or interface with a third-party die bonder through hardware and software integration.
- Scope of use
- It prepares dies for D2W hybrid and fusion bonding, including chiplet and heterogeneous-integration flows. Carriers or film frames must support plasma activation and the cleanliness needed for bonding.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCleaning and activation do not correct topography outside the bonding window or qualify a particular material stack. Available module, carrier and material combinations need confirmation; metrology described in the 2021 paper should not be assumed to be standard on current systems.
What to prepareBLNKK suggests preparing die dimensions, carrier/film-frame details, exposed materials, particle and surface-chemistry baselines, clean-to-bond intervals and downstream equipment interfaces when comparing preparation windows.
Confirm with the supplierConfirm cleaning/activation compatibility with materials and carriers, module configuration, allowable queue time and bonder integration. If die-height or placement feedback is needed, confirm current metrology options and acceptance methods.
- Public evidence
- The current page and V26/01 flyer list up to six process modules, cassette-to-cassette/FOUP-to-FOUP handling and SECS/GEM. An April 2021 white paper describes its preparation role in direct-placement D2W bonding.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.