Advanced-package fault isolation and root-cause analysis

Eurofins EAG Laboratories · Reliability qualification and failure analysis

Purpose: Investigate advanced-package anomalies and intermittent failures using electrical and package-integrity evidence.
Technical approach: Selects verification, SAM, X-ray/CT, thermal imaging and fault isolation, with cross-sections, SEM/EDS or FIB for physical confirmation as needed.
Scope of use: For design debug, assembly, reliability-test failures and returns involving stacked die, flip-chip, underfill and joints.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Localizing an anomaly does not necessarily establish root cause. Agree the sequence, controls and permitted destructive analysis before altering samples.
What to prepare
Prepare symptoms, reproduction conditions, test/process records, failed and good controls, construction details and previous results.
Confirm with the supplier
Confirm methods, sample handling, destructive-analysis authorization, report scope, timing and costs.
Public evidence: Official service and application material document customized verification, nondestructive checks, fault isolation and physical analysis.

Supporting references

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