Advanced-package fault isolation and root-cause analysis
Investigate advanced-package anomalies and intermittent failures using electrical and package-integrity evidence.
Eurofins EAG Laboratories
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Materials characterization · failure analysis · reliability testing
Applications: 3D package, WLCSP, flip-chip and assembly failures · Exposed copper/dielectric bonding surfaces · Original debonded surfaces · Exposed RDL targets · Representative joint materials
Catalog solutions · 5
EAG prebond XPS surface-chemistry service
Compare prebond cleaning and waiting conditions using surface-chemistry evidence alongside topography.
EAG TOF-SIMS residue-species service
Identify molecular and elemental signals in debonded surface residues against possible material sources.
EAG Auger seed/barrier residue analysis
Compare elements at abnormal RDL line-gap locations when investigating suspected seed/barrier residues.
EAG XRD crystalline joint-phase service
Identify crystalline phases in representative joint materials to complement cross-section and fracture-location evidence.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- EAG Auger seed/barrier residue analysis · RDL line-to-line shorts after fabrication →
- EAG prebond XPS surface-chemistry service · Pre-bond surface readiness and release for hybrid bonding →
- EAG TOF-SIMS residue-species service · Temporary-bond residue and cleaning compatibility →
- EAG XRD crystalline joint-phase service · Brittle fracture at solder IMC interfaces →
- Advanced-package fault isolation and root-cause analysis · Brittle fracture at solder IMC interfaces →
Public sources
- Product information: Advanced-package fault isolation and root-cause analysis
- Technical reference: Failure analysis of ICs and components (PDF)
- Technical reference: EAG prebond XPS surface-chemistry service (PDF)
- Product information: EAG TOF-SIMS residue-species service
- Product information: EAG Auger seed/barrier residue analysis
- Product information: EAG XRD crystalline joint-phase service
Contact information
Contact the supplier directly through its official channels.
United States · General contact
Eurofins EAG Laboratories — General and Technical Inquiries
- Phone
- +1 800 366 3867
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Eurofins EAG Laboratories — Materials Characterization Marketing & Sales (Brenda Tseng)
Official source ↗Source checked
Mainland China · Supplier office
Eurofins EAG Laboratories — Shanghai Materials and Electronics Laboratory
- Phone
- +86 21 6879 6088
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier office · Sales inquiries
Eurofins EAG Laboratories — Sales Representative (Claire Chang)
Official source ↗Source checked
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