IoN 10Q plasma cleaning and descum

PVA TePla · Process equipment and thermal control

Purpose: Evaluate plasma cleaning for photoresist residue and surface contamination before subsequent processing.
Technical approach: Plasma performs ashing, descum and activation; the recipe editor controls process steps.
Scope of use: Listed applications cover photoresist ashing, descum, cleaning and activation. Suitability for particular residues and materials requires sample evaluation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Descum capability does not establish removal of every plasma-dicing sidewall residue. The page provides no application-specific selectivity or sample-validation results.
What to prepare
BLNKK suggests residue analysis, before/after images, material stacks and sample geometry, together with criteria for cleanliness and material damage.
Confirm with the supplier
Discuss gases and recipes for the actual residue, sidewall access, material compatibility, trial processing and post-clean inspection.
Public evidence: The IoN 10Q product page describes these applications, tabletop construction, recipe controls and process monitoring.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.