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View contact information ↓Applications: FO-PLP, panel packages and power modules · Resist residue and surface processing · Regional stress in transmitting wafers · Contract inspection of bonded package interfaces
Voids, delamination and thickness variation can develop at soldered or sintered interfaces in large packaging panels. Acoustic reflection imaging helps locate internal interface anomalies and establish process reference data.
Evaluate plasma cleaning for photoresist residue and surface contamination before subsequent processing.
Regional wafer-stress observations can help compare TSV models and process changes.
Commission bonded-interface observations when in-house acoustic equipment is unavailable, comparing suspect samples with controls or process variants.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Contact the supplier directly through its official channels.
Taiwan and China contacts serve regional sales. Contact Analytical Systems or OKOS for acoustic inspection and Plasma Solutions for plasma products; group headquarters provides general routing. The form lets you select a technology and product purchase or contract service. Official source ↗
United States · Supplier office
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Taiwan · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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Germany · Headquarters
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Germany · Supplier office
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Germany · Supplier office
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Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.