SAM Auto Panel acoustic inspection for panel-level packaging
PVA TePla · Warpage, topography and stress metrology
- Purpose
- Voids, delamination and thickness variation can develop at soldered or sintered interfaces in large packaging panels. Acoustic reflection imaging helps locate internal interface anomalies and establish process reference data.
- Technical approach
- High-frequency ultrasound scans interfaces and uses echo amplitude and timing to distinguish acoustic differences. Auto Panel provides automated panel inspection and simultaneous multilayer inspection; the available depth gates and scan modes depend on configuration.
- Scope of use
- The system targets fan-out panel-level packaging and process control of soldered/sintered interfaces. Published panel examples range from 300 × 300 to 750 × 750 mm; holders, materials and inspection depths require confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCoupling, material attenuation, specimen thickness and interface depth affect visibility. Higher frequency does not ensure better detection of every deep defect, and acoustic contrast cannot directly establish joint strength.
What to prepareBLNKK recommends preparing panel dimensions, the material stack, target interface depths and defect locations, plus reference and suspect samples. Include coupling-medium compatibility, acceptable scan time and available sectioning results.
Confirm with the supplierConfirm holders, dimensions, transducer frequency, depth gating and supported scan modes, then validate interpretation on samples. Discuss coupling/drying, cleanroom requirements and automated data integration.
- Public evidence
- The system page lists Class 10 cleanroom operation, multilayer inspection and defects including voids, delamination, inclusions and thickness variation. The SAM technology page explains coupling and depth/resolution tradeoffs; neither qualifies detection performance for a particular panel.
Supporting references
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.