DME8061 post-grinding plasma stress relief
DISCO · Process equipment and thermal control
- Purpose
- Grinding damage can affect thin-die strength; post-treatment and handling conditions need comparison.
- Technical approach
- DME8061 removes the grinding-damaged layer using non-contact plasma. Gas switching permits consecutive gettering-layer formation.
- Scope of use
- The supplier lists Φ300 mm, thinning and DBG/SDBG applications, with process-specific MUSUBI equipment integration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThe source does not establish repair of arbitrary deep cracks or elimination of every debond failure. Qualify removal, compatibility and strength improvement. The manufacturer explicitly requires customer-provided gas abatement.
What to prepareBLNKK suggests preparing materials, remaining thickness, grinding/dicing history, damage/strength comparisons and handling/support arrangements.
Confirm with the supplierConfirm standard specifications, gases/gettering recipe, removal depth, thermal load, integration and abatement configuration before representative-wafer trials.
- Public evidence
- The named page documents removal/gettering, grinder–etcher–mounter workflow and SF6/Ar gases.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.