TAIKO rim-supported ultra-thin wafer grinding
Thinning reduces wafer stiffness, making warpage and handling more difficult. TAIKO retains a peripheral support ring to help process thin wafers.
DISCO
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View contact information ↓Public capability summary
- Wafer grinding · dicing · thinning and singulation
Other names: DISCO Corporation
Applications: Ultra-thin wafers, power devices and TSVs · Thin wafers and DBG/SDBG · SD-compatible wafers within 200 mm · Thin-wafer cutting / DBG
Catalog solutions · 4
DME8061 post-grinding plasma stress relief
Grinding damage can affect thin-die strength; post-treatment and handling conditions need comparison.
DFL7341 internal-modification laser singulation
Compare internal-modification and surface-ablation singulation for die-edge damage.
DFD6363 blade dicing / DBG half cuts
Thin-wafer DBG assessment needs half-cut groove and subsequent grind-separation damage comparisons.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Ultrathin-wafer backgrinding and stress-relief evaluation · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- Dicing Before Grinding flow evaluation · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- DME8061 post-grinding plasma stress relief · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- DFD6363 blade dicing / DBG half cuts · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- TAIKO rim-supported ultra-thin wafer grinding · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- Check laser test-dicing and processing scope · Heat-affected damage from laser singulation →
- DFL7341 internal-modification laser singulation · Heat-affected damage from laser singulation →
- Check plasma-dicing and pretreatment configurations · Sidewall residue and cleaning after plasma dicing →
Public sources
- Product information: TAIKO rim-supported ultra-thin wafer grinding
- Technical reference: DISCO technical briefing: TAIKO thinning flow (December 2022) (PDF)
- Public reference: cn_t/solution/library/grinder/taiko_process.html
- Product information: DME8061 post-grinding plasma stress relief
- Product information: DFL7341 internal-modification laser singulation
- Product information: DFD6363 blade dicing / DBG half cuts
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office
DISCO HI-TEC AMERICA, INC. — San Jose (California, Idaho, Nevada and Utah)
- Phone
- +1 408 987 3776
Official source ↗Source checked
Taiwan · Supplier office
DISCO HI-TEC TAIWAN CO., LTD. — Xindian Headquarters
- Phone
- +886 2 2913 8877
Official source ↗Source checked
Mainland China · Supplier office
DISCO HI-TEC CHINA CO., LTD. — Shanghai (Shanghai, Zhejiang and Nantong)
- Phone
- +86 21 5027 8018
Official source ↗Source checked
More regional contacts (2)
Japan · Headquarters · Sales inquiries
DISCO CORPORATION — Global Sales
- Phone
- +81 3 4590 1100
Official source ↗Source checked
Taiwan · Supplier office
DISCO HI-TEC TAIWAN CO., LTD. — Hsinchu Office
- Phone
- +886 3 550 9711
Official source ↗Source checked
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