TAIKO rim-supported ultra-thin wafer grinding

DISCO Corporation · Process equipment and thermal control

Purpose: Thinning reduces wafer stiffness, making warpage and handling more difficult. TAIKO retains a peripheral support ring to help process thin wafers.
Technical approach: Back-grinding leaves an approximately 3 mm outer ring while thinning the inner area. The wafer’s own ring provides support; downstream processing includes ring removal and singulation.
Scope of use: DISCO lists 200/300 mm equipment and downstream through-hole, bump and metallization processing. The December 2022 briefing illustrates TAIKO for silicon power devices.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Thin-wafer support does not establish control of package-level thermal warpage. The ring must suit downstream operations; tape or other support may still be used.
What to prepare
BLNKK suggests preparing wafer material, dimensions, target thickness, edge-device layout, warpage data and downstream flow for representative trials.
Confirm with the supplier
Confirm model, ring geometry, grinding/stress-relief process, tape, handling and ring-removal compatibility. Agree on quality and measurement acceptance criteria.
Public evidence: The process page explains strength and warpage benefits; the 2022 flow includes tape, backside processing and ring removal. No universal wafer-warpage guarantee is established.

Supporting references

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