DFD6363 blade dicing / DBG half cuts
DISCO · Process equipment and thermal control
- Purpose
- Thin-wafer DBG assessment needs half-cut groove and subsequent grind-separation damage comparisons.
- Technical approach
- DFD6363 uses facing dual blade spindles for full/half cuts; optional 3D profiling measures groove width/depth at specified locations.
- Scope of use
- The stated scope includes up to 300 mm workpieces and DBG; evaluate tape, streets, low-k/metal stacks and subsequent grinding.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsGroove profiling is not volumetric internal-crack inspection or a damage-free thin-wafer guarantee. Profiling and two-way frame/wafer transfer are optional.
What to prepareBLNKK suggests documenting blade, feed, depth, water and tape support, with kerf/chipping and pre/post-grind strength comparisons.
Confirm with the supplierConfirm materials/thickness, blade/depth windows, handling/support configuration, profiling scope and integration with subsequent grinding.
- Public evidence
- The named page documents blade cuts, DBG, optional groove measurement and model specifications.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.