DFL7341 internal-modification laser singulation

DISCO · Process equipment and thermal control

Purpose: Compare internal-modification and surface-ablation singulation for die-edge damage.
Technical approach: Internal laser modification precedes tape-expansion separation; DFL7341 includes surface-height and shape-related controls.
Scope of use: Evaluate compatible wafers within Φ200 mm with material-specific laser/stack validation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Library separation equipment is not necessarily installed on the saw. Dry processing does not prove damage-free stacks.
What to prepare
BLNKK suggests preparing transmission/absorption, stacks, thickness, streets and focus conditions, plus sidewall, strength and electrical comparisons.
Confirm with the supplier
Confirm laser configuration, modification depth, height controls, expansion equipment/conditions and target-wafer damage validation.
Public evidence: The product page documents machine scope; the separate library explains modification and expansion.

Supporting references

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