TOLL copper-clip power packaging service

Amkor Technology · Package architecture and warpage compensation

Purpose: Power devices need interconnect comparisons against electrical, thermal and package-outline requirements.
Technical approach: Amkor TOLL offers Cu clips, clip-plus-Cu-wire and multiple-Cu-wire interconnects. The sheet lists a copper leadframe and solder-paste die attach.
Scope of use: Supplier-listed high-power MOSFET/TOLL applications; qualify die, pads and thermal design.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published conditions do not qualify an individual die/process. Al wires remain marked under development in the sheet. Confirm options, joints and thermal paths; this is not a direct repair for unknown existing defects.
What to prepare
BLNKK suggests preparing die/pads, current/switching conditions, interconnect/cooling requirements and existing joint-quality/reliability evidence.
Confirm with the supplier
Confirm options, upper/lower joint materials, customization/supply, test scope and project qualification, then agree on samples and acceptance.
Public evidence: Currently linked DS618D-EN (02/21) documents interconnects, materials, qualification conditions and power-device test capabilities.

Supporting references

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