S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration
Multi-die and memory integration needs dense, short die-to-die connections while balancing package size, electrical performance, cost and thermomechanical behavior.
Amkor Technology
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- S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration · Package architecture and warpage compensation
- Interposer PoP low-warpage dual-substrate stacked package · Package architecture and warpage compensation
Applications: AI/HPC, networking, multi-die and memory · Mobile/client logic-memory and stacked packages · Power MOSFETs and TOLL · BGA controlled cycling and failure analysis · Die-to-die package-path electrical correlation
Catalog solutions · 5
Interposer PoP low-warpage dual-substrate stacked package
Integrates logic, memory and other devices in a compact stack while addressing interconnects and package-unit warpage.
TOLL copper-clip power packaging service
Power devices need interconnect comparisons against electrical, thermal and package-outline requirements.
Amkor board-level reliability and failure analysis
Compare BGA board-level cycling damage using traceable test and failure-analysis evidence.
Amkor package design characterization
Package models and electrical measurements can help assess package-path contributions to chiplet signal-margin problems and power integrity.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Interposer PoP low-warpage dual-substrate stacked package · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Amkor package design characterization · Temperature-dependent errors in chiplet die-to-die links →
- Amkor board-level reliability and failure analysis · Board-level BGA solder-joint fatigue under thermal cycling →
- TOLL copper-clip power packaging service · Copper-clip attachment integrity in power devices →
Public sources
- Product information: S-SWIFT organic RDL fan-out-on-substrate heterogeneous integration
- Technical reference: Heterogeneous integration using organic interposer technology: S-SWIFT simulations and test vehicles (PDF)
- Public reference: document-library/
- Product information: Interposer PoP low-warpage dual-substrate stacked package
- Public reference: jp/wp-content/uploads/2019/08/Interposer-PoP-DS840.pdf
- Product information: TOLL copper-clip power packaging service
- Technical reference: Amkor board-level reliability and failure analysis (PDF)
- Product information: Amkor package design characterization
Contact information
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United States · Headquarters
Amkor Technology — Corporate Headquarters
- Phone
- +1 480 821 5000
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Amkor Technology Taiwan Ltd. — Zhubei
- Phone
- +886 3 598 2000
Official source ↗Source checked
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