Amkor package design characterization

Amkor Technology · Engineering measurement and characterization

Purpose: Package models and electrical measurements can help assess package-path contributions to chiplet signal-margin problems and power integrity.
Technical approach: Amkor combines 2D, 3D and full-wave package simulations with time- and frequency-domain measurements and design collaboration.
Scope of use: For package model/measurement correlation. Published services also include thermal, mechanical and RF characterization; confirm project-specific scope and acceptance.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published capabilities do not imply unrestricted external commissioning or chiplet-protocol compliance. Confirm accessible ports and package boundaries; this does not automatically diagnose on-die causes.
What to prepare
BLNKK suggests preparing package routing, signal/return paths, available models, failure conditions and measurement calibration/de-embedding data.
Confirm with the supplier
Confirm project acceptance, sample and confidentiality arrangements, analysis conditions, deliverables and validation criteria.
Public evidence: The official service page and electrical service sheet describe these methods and SI/PI analysis supporting package co-design.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.