Interposer PoP low-warpage dual-substrate stacked package
Amkor Technology · Package architecture and warpage compensation
- Purpose
- Integrates logic, memory and other devices in a compact stack while addressing interconnects and package-unit warpage.
- Technical approach
- EMC surrounds the die between a bottom substrate and top interposer connected with copper-core balls. Die attachment can use TCNCP or reflow with CUF, while the interposer supports memory, passives and other top-side configurations.
- Scope of use
- The platform addresses logic-memory PoP integration, with mobile products among documented applications. Common dimensions, die thicknesses and reference stacks are not universal design limits; I/O, dimensions and material configurations require design-specific confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSupplier-stated low unit warpage does not demonstrate suppression of thermal warpage reversal. Reference stacks do not qualify every design.
What to prepareBLNKK suggests die/substrate/interposer geometry and materials, thermal history, top-device configuration and measured warpage.
Confirm with the supplierConfirm stack-specific design rules, materials, temperature-dependent warpage and reliability evidence, current specifications and trial options.
- Public evidence
- Amkor’s page and February 2022 datasheet describe the dual-substrate architecture, CCB connections, volume experience and reference stack-ups.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.