A6750 MWIR visible-surface thermal-transient imaging
FLIR · Warpage, topography and stress metrology
- Purpose
- Compare visible package/neighboring-component temperatures and response times after load changes to support HBM thermal-interaction evaluation.
- Technical approach
- A6750 uses a cooled InSb detector for radiometric thermal imaging, with synchronization inputs/outputs for external events.
- Scope of use
- For surfaces with infrared access, calibrated emissivity and adequate optical resolution. Pair observation locations with load and temperature references.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCannot directly read temperatures of buried HBM layers through opaque packaging. A6750 specifications exclude microscopes; other family variants do not establish its microscopic capability.
What to prepareBLNKK suggests target locations/sizes, emissivity/reflections, load-switching signals, expected timescales and available temperature references.
Confirm with the supplierConfirm optics/object-plane resolution, exposure/frame rate, calibrated temperature range and synchronization uncertainty between camera and load data.
- Public evidence
- FLIR describes rapid thermal events, electronics inspection, radiometric streaming and synchronization, with model-specific specifications.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.