A6750 MWIR visible-surface thermal-transient imaging
Compare visible package/neighboring-component temperatures and response times after load changes to support HBM thermal-interaction evaluation.
FLIR
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- HBM-related load changes require comparisons of temperature response and delay at visible package surfaces or nearby components.
Other names: Teledyne FLIR · Flir
Applications: HBM / visible package surfaces
Catalog solutions · 1
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For electronics thermal analysis and research imaging, use Contact Sales and specify Research & Science, the product and measurement requirements. Taiwan and Shanghai phones provide commercial-office routing; the US Sales number is a US toll-free number. Official source ↗
United States · Supplier office · Sales inquiries
FLIR — US Contact Sales
- Phone
- +1 866 477 3687
Official source ↗Source checked
Taiwan · Supplier office
Teledyne FLIR Commercial Systems, Inc. — Taiwan Branch
- Phone
- +886 2 2656 0399
Official source ↗Source checked
Mainland China · Supplier office
FLIR Optoelectronic Technology (Shanghai) Co., Ltd.
- info@flir.cn
- Phone
- +86 21 5169 7628
Official source ↗Source checked
More regional contacts (1)
United States · Supplier office
Teledyne FLIR, LLC — Goleta / General Office Routing
- Phone
- +1 805 392 3775
Official source ↗Source checked
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