BrewerBOND VersaLayer dual-layer temporary bonding system

Brewer Science · Materials and interface control

Purpose: Thin-wafer processing and release require temporary support evaluated against topography, thermal history and debonding conditions.
Technical approach: Device-side thermoplastic T1100 provides a conformal coating; carrier-side C1300 flows during bonding and exhibits no melt flow after cure in the VersaLayer system.
Scope of use: Listed 3D-IC, power, MEMS and FOWLP applications with mechanical or laser debonding, subject to material/process confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Two layers do not imply transferable grade specifications or crack-free processing, and cannot repair existing grinding damage. Thermal/bonding conditions require the selected grade and recipe.
What to prepare
BLNKK suggests documenting wafer thickness, topography, carriers, films, cure and subsequent heating, with stage-specific defects, TTV and release residues.
Confirm with the supplier
Confirm grades, bonding/cure windows, carrier/debond configuration, cleaning compatibility and representative support/damage evaluation data.
Public evidence: The current page and September 2018 launch distinguish layer roles, pre-/post-cure behavior and release options.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.