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View contact information ↓Applications: Ultrathin wafers, TSV, RDL and 3D WLP · Ultrathin wafers, 3D ICs and FOWLP
Wafer thinning, TSV reveal and backside RDL processing require temporary carrier support followed by controlled release. This material supports planning a temporary bonding and debonding flow for ultrathin wafers.
Thin-wafer processing and release require temporary support evaluated against topography, thermal history and debonding conditions.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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United States · Headquarters
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Taiwan · Supplier office
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Mainland China · Supplier office
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United States · Supplier office · Technical support
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.