WaferBOND HT-10.11 temporary bonding material for ultrathin wafers
Brewer Science · Material properties and interface engineering
- Purpose
- Wafer thinning, TSV reveal and backside RDL processing require temporary carrier support followed by controlled release. This material supports planning a temporary bonding and debonding flow for ultrathin wafers.
- Technical approach
- An organic coating is applied to a device wafer or carrier and bonded into a supported stack. Published HT-10.11 bonding temperatures are 130–180°C; thermal-slide, chemical, mechanical and laser debonding each have carrier or release-material prerequisites. The technology page also lists photonic debonding with an inorganic light-absorber layer.
- Scope of use
- Named applications include wafers below 75 µm, MEMS, 3D WLP, TSV reveal and RDL; published coating thickness is 20–130 µm. The product page lists thermal stability up to 250°C, with the actual thermal and chemical history still to confirm.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsChemical debonding requires solvent access through a perforated carrier or small diced dies; mechanical or laser release requires a compatible release material. The material rating does not qualify identical conditions across every flow or guarantee low warpage and residue-free release. Photonic release additionally needs an inorganic light-absorber layer and compatible carrier.
What to prepareBLNKK recommends preparing target wafer thickness, surface topology, carrier material, coating thickness and the complete thermal/chemical history. Include the proposed release method and acceptance checks for cracks, residue and flatness.
Confirm with the supplierConfirm current HT-10.11 availability and processing guidance, carrier/release-layer combinations and bonding, debonding and cleaning equipment compatibility. Ask how to validate thermal budget, solvent exposure and residue control for the actual process.
- Public evidence
- The named-grade page provides coating, bonding, thermal-debonding and stability data. The debonding page describes HT-10.11 prerequisites for different release routes; these do not qualify breakage, residue or warpage on a customer stack.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.