3M 7421 polyimide process-protection tape

3M · Material properties and interface engineering

Purpose: Evaluate surface masking and protection during semiconductor molding, including residue and surface condition after thermal processing and tape removal.
Technical approach: 7421 combines polyimide backing with thermally cross-linkable acrylic adhesive to limit unexpected adhesion buildup after high-temperature processing.
Scope of use: Listed uses include molding/metal surfaces, masking, protection and temporary bonding. Actual contact surfaces and thermal histories require evaluation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Typical heat/peel examples do not guarantee residue-free removal from every substrate. Tape does not compensate mold-seal wear or establish flash root causes.
What to prepare
BLNKK suggests contact materials, thermal/pressure histories, peel methods, post-removal images and installed tape-thickness effects.
Confirm with the supplier
Confirm compatible surfaces, heat window, removal timing/angle, residue/damage criteria and current data-sheet/supply specifications.
Public evidence: The product page and April 2023 data sheet describe construction and typical heated stainless-steel peel tests.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.