WSS temporary wafer bonding and debonding
Wafer thinning and backside processing require temporary support followed by controlled release. WSS combines carriers and bonding/removal materials for evaluating thin-wafer handling and debonding flows.
3M
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- Thermal interface · adhesives · dielectric and electronics assembly materials
Applications: Thin wafers / FOWLP / FOPLP · Semiconductor molding surface protection · Component/heat-sink thermal bonding comparison
Catalog solutions · 3
3M 7421 polyimide process-protection tape
Evaluate surface masking and protection during semiconductor molding, including residue and surface condition after thermal processing and tape removal.
3M 8810 thermal adhesive transfer tape
Component-to-heatsink comparisons need both thermal transfer and attachment, with controlled contact area and trapped air.
Candidates in engineering problem guides
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- 3M 8810 thermal adhesive transfer tape · Uneven heat-spreader contact and local hot spots in multi-die packages →
- Wafer Support System temporary-carrier evaluation · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- 3M 7421 polyimide process-protection tape · Mold flash and the tool-sealing process window →
Public sources
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Taiwan · Supplier office
3M Taiwan
- Phone
- +886 2 2785 9338
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