CHIPCOAT U8439-1 capillary underfill for large ICs

NAMICS · Material properties and interface engineering

Purpose: Evaluate underfill for large flip-chip assemblies by comparing filling behavior and cured interface condition.
Technical approach: U8439-1 uses capillary flow to introduce insulating resin between bumped die and substrate, then forms a cured underfill layer.
Scope of use: NAMICS specifically lists low-K and large-IC applications. Actual gaps, bump structures and surfaces require confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Neighboring grades do not establish U8439-1 narrow-gap or bump-specific suitability. Property data do not guarantee void-free filling or reliability of the actual package.
What to prepare
BLNKK suggests die/gap/bump layout, surface/flux residue, dispense/cure history and cross-section or acoustic inspection results.
Confirm with the supplier
Confirm filler/gap compatibility, surface preparation and flow/cure windows; discuss matched filling, interface and thermal-cycling evaluations.
Public evidence: The flip-chip table names U8439-1 and lists viscosity, Tg, modulus and thermal-expansion data.

Contact the supplier

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