Chipcoat G8345 low-warpage dam-and-fill encapsulants
Wire-bonded CSP/BGA devices need protective encapsulation with warpage control. Chipcoat G8345 grades are liquid-encapsulation candidates.
NAMICS
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Underfill · encapsulants · conductive adhesives for advanced packaging
Applications: Wire-bonded CSP/BGA and local liquid encapsulation · Large-IC flip-chip underfill · Power IC / SiC / GaN die attach · Advanced-package / power-module TIM · CPO / silicon-photonics fiber and FAU
Catalog solutions · 5
CHIPCOAT U8439-1 capillary underfill for large ICs
Evaluate underfill for large flip-chip assemblies by comparing filling behavior and cured interface condition.
UNIMEC H9888-3 pressureless silver-sinter die attach
Evaluate silver-sintering die attach for power chips, including how deposition and thermal history affect porosity and interfaces.
NAMICS heat-curing conductive TIM paste
TIM comparisons need contact, bondline thickness and cured properties to assess assembled thermal performance.
NAMICS CPO optical-coupling and fiber-fixation adhesives
Post-fixation CPO loss/drift needs comparison with alignment, adhesive, cure and strain conditions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Chipcoat G8345 low-warpage dam-and-fill encapsulants · Warpage reversal during cooling in large 2.5D FCBGA packages →
- CHIPCOAT U8439-1 capillary underfill for large ICs · Underfill voids and post-cure delamination in large multi-die packages →
- NAMICS heat-curing conductive TIM paste · Uneven heat-spreader contact and local hot spots in multi-die packages →
- UNIMEC H9888-3 pressureless silver-sinter die attach · Densification window for silver-sintered attachment →
- NAMICS CPO optical-coupling and fiber-fixation adhesives · Optical alignment loss during CPO fiber attachment →
Public sources
- Product information: Chipcoat G8345 low-warpage dam-and-fill encapsulants
- Public reference: en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4
- Product information: CHIPCOAT U8439-1 capillary underfill for large ICs
- Product information: UNIMEC H9888-3 pressureless silver-sinter die attach
- Product information: NAMICS heat-curing conductive TIM paste
- Product information: NAMICS CPO optical-coupling and fiber-fixation adhesives
Contact information
Contact the supplier directly through its official channels.
United States · Supplier office · Sales inquiries
NAMICS Technologies, Inc. — United States Sales / San Jose
- sales@namics-usa.com
- Phone
- +1 408 516 4611
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Taiwan Namics Electronics Co., Ltd. — Taichung Sales
- sales@namics-tw.com
- Phone
- +886 4 2259 5105
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Shanghai Namics Co., Ltd. — China Sales
- sales@namics-cn.com
- Phone
- +86 21 2024 6358
Official source ↗Source checked
More regional contacts (1)
Taiwan · Supplier office · Sales inquiries
Taiwan Namics Electronics Co., Ltd. — Hsinchu Sales
- sales@namics-tw.com
- Phone
- +886 3 579 8098
Official source ↗Source checked
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