Chipcoat G8345 low-warpage dam-and-fill encapsulants
NAMICS · Material properties and interface engineering
- Purpose
- Wire-bonded CSP/BGA devices need protective encapsulation with warpage control. Chipcoat G8345 grades are liquid-encapsulation candidates.
- Technical approach
- A high-viscosity dam defines the boundary before lower-viscosity fill. G8345-6 targets low warpage/high fluidity; G8345-29 targets low warpage/fine filler.
- Scope of use
- NAMICS lists wire-bonded CSP/BGA applications. Confirm the dam/fill pairing for the structure.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsA low-warpage label does not establish package performance. Validate the actual material combination and structure.
What to prepareBLNKK suggests preparing package dimensions, wire-loop details, substrate information and cure history for representative trials.
Confirm with the supplierConfirm grade pairing, current data sheets, dispensing/cure guidance, storage conditions and validation samples.
- Public evidence
- The official table lists G8345-6/-29 characteristics, viscosity, Tg, modulus and CTE for initial material screening, without package-specific warpage guarantees.
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.