UNIMEC H9888-3 pressureless silver-sinter die attach

NAMICS · Material properties and interface engineering

Purpose: Evaluate silver-sintering die attach for power chips, including how deposition and thermal history affect porosity and interfaces.
Technical approach: H9888-3 forms an electrically/thermally conductive sintered-silver layer; NAMICS identifies it as pressureless bonding material.
Scope of use: Listed uses include power IC, SiC/GaN, large-area chips and printing/dispensing. Metallization and actual sintering configuration require confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Pressureless does not establish compatibility with every metallization. Other grades' bare-copper applications and tabulated properties do not qualify the actual package.
What to prepare
BLNKK suggests die size, both metallizations, deposition/bondline, drying/sintering history and porosity, shear and cycling data.
Confirm with the supplier
Confirm compatible surfaces, deposition/drying and atmosphere-specific ramp/hold windows; discuss bondline porosity, adhesion and thermal-performance validation.
Public evidence: The official table lists grade-specific properties and different H9888-3 air/nitrogen thermal profiles.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.