NAMICS heat-curing conductive TIM paste

NAMICS · Material properties and interface engineering

Purpose: TIM comparisons need contact, bondline thickness and cured properties to assess assembled thermal performance.
Technical approach: NAMICS offers dispensable, heat-curing TIM paste for interface/contact and cure-condition trials.
Scope of use: Supplier-listed power modules and automotive/data-center advanced packages; confirm grade, electrical requirements and cure compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published conductivity is test-structure dependent, not arbitrary assembly resistance. Electrical resistivity/insulation is unspecified; qualify modulus, contact and aging for the offered grade.
What to prepare
BLNKK suggests preparing interface materials/area, thickness, dispense/compression/cure history and electrical/thermal requirements, with resistance/aging comparisons.
Confirm with the supplier
Confirm grade, test structure, viscosity/modulus/electrical properties, cure window, storage and rework conditions before representative trials.
Public evidence: Published cure and laser-flash data specify a three-layer Si/Cu structure; no named grade is public.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.