SUMIRESIN EXCEL CRM resin die-bonding pastes

Sumitomo Bakelite · Material properties and interface engineering

Purpose: Initial resin die-attach voids/quality need comparison with materials, surfaces, deposits and cure history.
Technical approach: SUMIRESIN EXCEL CRM is a one-component adhesive family; grade-specific resins/fillers cure into a die-attachment layer.
Scope of use: Chip/carrier assemblies accepting resin die attach; confirm conductive/insulating properties and cure method by grade.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not combine different grades' conductivity, modulus or cure data. The page's sintering discussion does not apply to every resin grade. Public evidence guarantees neither void-free projects nor repair of existing voids.
What to prepare
BLNKK suggests preparing die/carrier, metallization, bondline, deposit/cure history and void, adhesion and aging comparisons.
Confirm with the supplier
Confirm grade/electrical properties, flow/filler, cure window, storage, compatibility and reliability evidence before defining trials and acceptance.
Public evidence: Named series and representative-grade tables separately document resins, fillers, thermal/mechanical properties and cure conditions.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.