EME-L low-warpage liquid encapsulant
Large AI and chiplet packages need to balance post-encapsulation warpage, resin processing and downstream handling when selecting liquid encapsulants.
Sumitomo Bakelite
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Epoxy molding compounds · semiconductor encapsulation materials
Applications: Large AI, 2.xD/3D and chiplet packages · Semiconductor resin die attach · WLP redistribution dielectric · Organic IC substrates
Catalog solutions · 4
SUMIRESIN EXCEL CRM resin die-bonding pastes
Initial resin die-attach voids/quality need comparison with materials, surfaces, deposits and cure history.
SUMIRESIN EXCEL CRC-8600 WLP redistribution dielectric
RDL thermal-open comparisons need traceable dielectric materials and actual film-processing conditions to assess material/interface contributions.
SUMILITE LαZ low-CTE package-substrate materials
Package-warpage comparisons must assess substrate materials with the actual stack, copper layout and temperature history.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- SUMILITE LαZ low-CTE package-substrate materials · Warpage reversal during cooling in large 2.5D FCBGA packages →
- EME-L low-warpage liquid encapsulant · Warpage reversal during cooling in large 2.5D FCBGA packages →
- SUMIRESIN EXCEL CRC-8600 WLP redistribution dielectric · Cracking and intermittent opens in fine-line RDL after thermal cycling →
- SUMIRESIN EXCEL CRM resin die-bonding pastes · Initial die-attach voids and incomplete coverage →
Public sources
- Product information: EME-L low-warpage liquid encapsulant
- Technical reference: Trial launch of liquid encapsulant for advanced packages (PDF)
- Product information: SUMIRESIN EXCEL CRM resin die-bonding pastes
- Product information: SUMIRESIN EXCEL CRC-8600 WLP redistribution dielectric
- Product information: SUMILITE LαZ low-CTE package-substrate materials
Contact information
Contact the supplier directly through its official channels.
Use IT Materials Division for semiconductor molding compounds, wafer coating resins and die-bonding pastes. Taiwan and Suzhou phones provide semiconductor-materials company routing. The linked form is specifically for semiconductor epoxy molding compounds. Official source ↗
Taiwan · Supplier office
Sumitomo Bakelite (Taiwan) Co., Ltd. — Semiconductor Materials / Company Routing
- Phone
- +886 7 787 1285
Official source ↗Source checked
Mainland China · Supplier office
Sumitomo Bakelite (Suzhou) Co., Ltd. — Semiconductor Materials / Company Routing
- Phone
- +86 512 6761 3850
Official source ↗Source checked
Japan · Supplier office · Sales inquiries
Sumitomo Bakelite Co., Ltd. — IT Materials Division / Semiconductor Encapsulation
- Phone
- +81 3 5462 4015
Official source ↗Source checked
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