SUMIRESIN EXCEL CRC-8600 WLP redistribution dielectric

Sumitomo Bakelite · Material properties and interface engineering

Purpose: RDL thermal-open comparisons need traceable dielectric materials and actual film-processing conditions to assess material/interface contributions.
Technical approach: Photosensitive CRC-8600 wafer-coating resins form patterned redistribution dielectrics through exposure, development and subsequent processing.
Scope of use: Supplier-listed WLP redistribution layers, after confirming the selected grade, UBM, thickness, geometry and processing/cure flow.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Material selection cannot locate or repair existing opens. General properties do not replace stress, adhesion and electrical validation of actual films/interfaces.
What to prepare
BLNKK suggests documenting grades, UBM, films, patterns, exposure/development and curing, with before/after cycling open-location, interface and electrical evidence.
Confirm with the supplier
Confirm grades, processing windows, temperature-dependent properties, interface compatibility and applicable reliability-test conditions/results.
Public evidence: The named RDL subsection describes resolution, UBM adhesion and solvent resistance; these properties do not qualify the actual package for thermal cycling.

Contact the supplier

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