SUMILITE LαZ low-CTE package-substrate materials
Sumitomo Bakelite · Material properties and interface engineering
- Purpose
- Package-warpage comparisons must assess substrate materials with the actual stack, copper layout and temperature history.
- Technical approach
- LαZ low-expansion, high-modulus laminates/prepreg use resin and filler design to tune substrate thermomechanical behavior.
- Scope of use
- Organic IC-substrate material/stack redesign with confirmed grades, electrical requirements and fabrication processes.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLow CTE/high modulus alone cannot guarantee low finished-package warpage or predict reversal. Grade-specific electrical and fabrication windows need separate validation.
What to prepareBLNKK suggests documenting stacks, thicknesses, copper distribution, cure/reflow histories and temperature-dependent properties, checking comparative models against measured warpage.
Confirm with the supplierConfirm grade data, directions/test conditions, stack/fabrication compatibility and representative package-warpage/reliability evidence.
- Public evidence
- The official family page lists laminates/prepreg and associates low CTE/high modulus with package-warpage improvement; evidence is qualitative at family level.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.