EME-L low-warpage liquid encapsulant

Sumitomo Bakelite · Material properties and interface engineering

Purpose: Large AI and chiplet packages need to balance post-encapsulation warpage, resin processing and downstream handling when selecting liquid encapsulants.
Technical approach: Uses formulation and processing development to balance warpage and processability; some grades combine under-mold and over-mold steps.
Scope of use: For material/process evaluation in large advanced packages; confirm available grades and validate filling, cure and reliability.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A trial announcement does not establish production qualification. Complete material, cure-window and package-warpage data are not disclosed there.
What to prepare
Prepare stack-up, dimensions/gaps, current filling/cure conditions and warpage, handling and reliability targets.
Confirm with the supplier
Confirm grades, samples, property/test data, under-mold support, qualification progress and supply plans.
Public evidence: The 2026 announcement reports April trial launches and a 2027 qualification/adoption goal. These are manufacturer plans and positioning, not package-specific validation.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.