SH-A204 BN-filled insulating thermal-bonding sheet

Mitsubishi Chemical Group · Material properties and interface engineering

Purpose: Assess heat transfer, electrical isolation and bond integrity between a power module and its cooling plate.
Technical approach: SH-A204 combines densely packed boron-nitride filler with high-purity epoxy to provide thermal conduction, insulation and adhesion.
Scope of use: The supplier lists transfer-molded power-module lamination and IMS/IMB applications.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
In-house comparisons do not qualify a user assembly. SH-A206 certification and stack recommendations cannot be transferred; chip-to-lid TIM suitability is not established.
What to prepare
BLNKK suggests preparing module and plate materials, sheet thickness, heat load, isolation targets, lamination history, and void or cycling observations.
Confirm with the supplier
Confirm sheet specification, surface preparation and cure windows, thermal-resistance and insulation test conditions, current certification status and interface reliability evidence.
Public evidence: The model table provides typical material data and identifies SH-A204 UL94 certification as pending.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.