jER epoxy resins for packaging formulations
Encapsulant and laminate development needs a suitable epoxy resin base, followed by evaluation of curing, adhesion and thermomechanical behavior in the complete formulation.
Mitsubishi Chemical Group
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- Engineering plastics · films · thermal and semiconductor materials
Applications: Encapsulant / laminate formulations · Power-module / cooling-plate lamination
Catalog solutions · 2
SH-A204 BN-filled insulating thermal-bonding sheet
Assess heat transfer, electrical isolation and bond integrity between a power module and its cooling plate.
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The Japan product inquiry form can route questions to the relevant product team. If you know the product name, the company recommends using its product detail page to contact the responsible team. The Taiwan offices belong to Mitsubishi Chemical Taiwan; confirm responsibility for a particular epoxy resin or thermal sheet. The Taiwan website also has a contact form. Official source ↗
Taiwan · Supplier office
Mitsubishi Chemical Taiwan Co., Ltd. — Hsinchu Headquarters
- Phone
- +886 3 598 5987
Official source ↗Source checked
Taiwan · Supplier office
Mitsubishi Chemical Taiwan Co., Ltd. — Taipei Office
- Phone
- +886 2 2586 7371
Official source ↗Source checked
Japan · General contact · Sales inquiries
Mitsubishi Chemical Group — Product Inquiry Call Center
- Phone
- +81 3 6748 7300
Official source ↗Source checked
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