Low-warpage lidded flip-chip package on a thin substrate
SHINKO ELECTRIC INDUSTRIES · Package architecture and warpage compensation
- Purpose
- High-power flip-chip packages must conduct heat into a top-side lid while controlling warpage from thin substrates and molded structures.
- Technical approach
- Exposes the die backside from the mold and connects it to a metal lid through TIM; the molded exposed-die structure and thin-core substrate are co-designed for heat flow, stiffness and warpage control.
- Scope of use
- Relevant to server processors, SSD controllers, image processors and high-heat automotive ICs, with die size, bumps or Cu pillars, underfill, TIM, lid and substrate stack co-designed.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThis is an integrated package/assembly route, not a drop-in material. Published dimensions and automotive uses do not guarantee a customer design; the built-in-component option remains under development.
What to prepareBring die size/power, interconnects, substrate stackup, TIM/lid concepts and warpage/thermal-resistance targets, plus board-assembly and reliability requirements.
Confirm with the supplierConfirm substrate/lid options, assembly conditions and design responsibilities, with thermal, warpage and reliability data for the proposed stack. Agree device qualification for automotive use and confirm option maturity separately.
- Public evidence
- The official page lists exposed-die molding, a 200 µm core and 4–6 substrate layers; the 2022 sheet also notes prior automotive-device use. The AEC-Q100 Grade 2 statement does not qualify every custom package.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.