Low-warpage lidded flip-chip package on a thin substrate
High-power flip-chip packages must conduct heat into a top-side lid while controlling warpage from thin substrates and molded structures.
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View contact information ↓Other names: SHINKO ELECTRIC INDUSTRIES
Applications: Server, SSD, imaging and automotive processors · Package heat-spreader contact evaluation · Wirebond surface/process comparison
High-power flip-chip packages must conduct heat into a top-side lid while controlling warpage from thin substrates and molded structures.
Compare spreader geometry, finish and interface contact along the package thermal path.
Wirebond comparisons need controlled leadframe surfaces and bonding processes.
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The listed phones are regional sales contacts in Taiwan, China and the US. The official product inquiry page routes to Japan and requests numbers and unaccented English letters; contact the regional office for local inquiries. Official source ↗
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Taiwan · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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