SHINKO Ni/Pd/Au pre-plated leadframes

Shinko Electric Industries · Material properties and interface engineering

Purpose: Wirebond comparisons need controlled leadframe surfaces and bonding processes.
Technical approach: PPF plates the leadframe with nickel/palladium/gold for chip-to-inner-lead and outer-lead-to-PCB interconnection.
Scope of use: A surface option for leadframe packages; confirm wire, bond location and process compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
PPF neither measures fatigue nor repairs cracks. General reliability descriptions do not qualify every wire/finish pairing or establish mission life.
What to prepare
BLNKK suggests recording wire, plating/storage surface condition, bond geometry and parameters, with pull/shear failure modes and stress histories.
Confirm with the supplier
Confirm available specifications, wire/finish compatibility, bonding window and surface storage, and agree thermal-cycle/fatigue and interface checks.
Public evidence: The official page describes the three-layer finish and eliminating external solder plating during IC assembly.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.