ACS200 Gen3 RDL resist coating/development
SUSS MicroTec · Process equipment and thermal control
- Purpose
- Evaluate RDL resist thickness, openings and development conditions.
- Technical approach
- Modular coating/developing combines solvent-atmosphere control, resist dispense and developer processes for thin/thick resists and polyimide.
- Scope of use
- SUSS identifies 100–200 mm wafers, RDL and thick-film packaging; material and handling compatibility depend on configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsUniform coating does not prove short-free RDL. Thin, warped or stacked wafers need handling verification.
What to prepareBLNKK suggests preparing material grades, viscosity, topography, target thickness and exposure conditions, alongside opening and residue measurements.
Confirm with the supplierConfirm dispense, developer, drying and handling modules, plus sample-specific acceptance criteria for thickness uniformity, openings and residues.
- Public evidence
- The named page describes GYRSET, dispense and development; an official portfolio separately lists the platform.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.