XBS300 high-precision temporary wafer bonding platform
Assess temporary carrier bonding before wafer thinning and backside processing, including support and subsequent release conditions.
SUSS MicroTec
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Wafer-level metrology · alignment · temporary bond and debond process insight
Applications: Thin wafers, backside processing and 2.5D/3D · 200 mm-class RDL resist patterning · Wafer packaging resist patterns · Tape-mounted thin wafers / temporary carriers · Permanent W2W bonding within 200 mm
Catalog solutions · 5
ACS200 Gen3 RDL resist coating/development
Evaluate RDL resist thickness, openings and development conditions.
MA12 Gen3 packaging resist exposure/alignment
Compare resist-pattern exposure/alignment before bump formation and subsequent height assessment.
XBC300 Gen2 carrier debond and residue cleaning
Separate thin-wafer debond and residue-cleaning stages when comparing cracks and contamination.
SB8 Gen2 permanent-wafer bonding development
Compare force, temperature and contact propagation during permanent wafer bonding.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- SB8 Gen2 permanent-wafer bonding development · Local interface voids after hybrid bonding →
- XBC300 Gen2 carrier debond and residue cleaning · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- XBS300 high-precision temporary wafer bonding platform · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- ACS200 Gen3 RDL resist coating/development · RDL line-to-line shorts after fabrication →
- MA12 Gen3 packaging resist exposure/alignment · Microbump height variation and coplanarity →
Public sources
- Product information: XBS300 high-precision temporary wafer bonding platform
- Public reference: en/content/download/2839/35480/202603_Company_Profile_16_9_01_EN.pdf?version=4
- Product information: ACS200 Gen3 RDL resist coating/development
- Product information: MA12 Gen3 packaging resist exposure/alignment
- Product information: XBC300 Gen2 carrier debond and residue cleaning
- Product information: SB8 Gen2 permanent-wafer bonding development
Contact information
Contact the supplier directly through its official channels.
Specify the product and process for lithography or temporary bonding/debonding inquiries. The US mailbox is the official North American customer-service routing contact, rather than a dedicated sales mailbox. Official source ↗
United States · Supplier office
SUSS MicroTec Inc. — Corona / North America Customer Routing
- Phone
- +1 951 817 3700
Official source ↗Source checked
Taiwan · Supplier office
SUSS MicroTec (Taiwan) Co., Ltd. — Zhubei Office
- info.tw@suss.com
- Phone
- +886 3 516 9098
Official source ↗Source checked
Mainland China · Supplier office
SUSS MicroTec (Shanghai) Co., Ltd.
- info.cn@suss.com
- Phone
- +86 21 5234 0432
Official source ↗Source checked
More regional contacts (1)
Germany · Headquarters
SUSS MicroTec SE — Garching Headquarters
- info@suss.com
- Phone
- +49 89 32007 0
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.