XBC300 Gen2 carrier debond and residue cleaning

SUSS MicroTec · Process equipment and thermal control

Purpose: Separate thin-wafer debond and residue-cleaning stages when comparing cracks and contamination.
Technical approach: Configured mechanical peel-off or transparent-carrier laser release pairs with wafer/carrier cleaning modules.
Scope of use: Evaluate compatible carrier, release-layer and tape systems in supported 200/300 mm configurations.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Module capabilities are not installed universally. Laser release needs transparent carriers; stress/residue claims are not project guarantees.
What to prepare
BLNKK suggests preparing adhesives/release layers, carriers/tapes, thickness/shape and staged crack/residue comparisons.
Confirm with the supplier
Confirm modules, mechanical/laser and chemical conditions, tape protection and downstream compatibility validation.
Public evidence: The page separates DB300T, LD300, AR300TF and AR300 functions.

Contact the supplier

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