SB8 Gen2 permanent-wafer bonding development
SUSS MicroTec · Process equipment and thermal control
- Purpose
- Compare force, temperature and contact propagation during permanent wafer bonding.
- Technical approach
- Programmable force, temperature and chamber pressure combine with sequential spacer removal and selected bond modes.
- Scope of use
- Evaluate compatible MEMS/package processes on wafers up to 200 mm with matched tooling.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsUniversal bonding does not qualify arbitrary Cu-hybrid interfaces; specifications are not necessarily valid simultaneously.
What to prepareBLNKK suggests preparing modes, surfaces/topography, stacks, actual thermal/force histories and void/alignment/electrical comparisons.
Confirm with the supplierConfirm tooling/configuration, interface preparation, annealing, wafer conditions and bond-quality validation.
- Public evidence
- The product page and 2026-version datasheet document controls/SSR and configuration-dependent specifications.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.