XBS300 high-precision temporary wafer bonding platform

SUSS MicroTec · Process equipment and thermal control

Purpose: Assess temporary carrier bonding before wafer thinning and backside processing, including support and subsequent release conditions.
Technical approach: A modular platform combines temporary bonding, ISA alignment and metrology; the portfolio also lists adhesive/release coating and thickness/TTV measurement.
Scope of use: Positioned for 200/300 mm thin-wafer processing with silicon and glass carriers; configuration depends on materials and process.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Alignment, TTV, warpage and debond damage are separate metrics. Platform capability does not qualify every adhesive/carrier/release combination.
What to prepare
BLNKK suggests preparing wafer/carrier materials and dimensions, target thickness, adhesive and temperature/pressure histories, plus stage-specific damage records.
Confirm with the supplier
Confirm compatibility, alignment/TTV acceptance conditions, module configuration, and the separate debonding and cleaning workflow.
Public evidence: The product page describes alignment and metrology; the current brochure distinguishes temporary bonding from the separate W2W hybrid-bond platform.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.