CELLESTA-i MD metal-exposed surface cleaning/drying

Tokyo Electron · Process equipment and thermal control

Purpose: Evaluate wet cleaning and drying of metal-exposed wafers before bonding.
Technical approach: Single-wafer chemical cleaning/wet etching combines chamber-atmosphere and IPA-dispense control to address particles and drying-related pattern collapse.
Scope of use: The named i MD covers 300 mm silicon and exposed metals including Cu; bonding-stack compatibility needs confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
No qualified recipe for the target hybrid-bond stack is published. Low-damage claims do not replace surface or bonding tests.
What to prepare
BLNKK suggests preparing exposed films, contaminants, topography, roughness and oxide tolerances, plus cleaning-to-bonding wait conditions.
Confirm with the supplier
Confirm chemical compatibility, drying configuration and acceptance checks for particles, surface loss, watermarks and subsequent bonding.
Public evidence: TEL’s i MD body and table identify cleaning, wet etching and New IPA dry/SMD.

Contact the supplier

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