Synapse Si / ZF 300 mm hybrid bonding with pre-anneal rework
Permanent wafer bonding needs controlled surfaces, alignment and inspection. Pre-anneal defects may warrant assessment of a rework route.
Tokyo Electron
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- Coater/developer · bonding · cleaning and wafer process equipment
Applications: CIS, memory, advanced logic and wafer-to-wafer 3D · 300 mm metal-exposed wafer surfaces
Catalog solutions · 2
CELLESTA-i MD metal-exposed surface cleaning/drying
Evaluate wet cleaning and drying of metal-exposed wafers before bonding.
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Contact information
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This form is for new equipment purchases, including wafer bonders/debonders and other semiconductor tools. Use the official contact page for service or used-equipment inquiries. The regional phones belong to semiconductor equipment sales and service offices. Official source ↗
United States · Supplier office · Sales inquiries
Tokyo Electron America, Inc.
- Phone
- +1 512 4241000
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Taiwan · Supplier office · Sales inquiries
Tokyo Electron Taiwan Ltd.
- Phone
- +886 3 6662266
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Tokyo Electron (Shanghai) Ltd.
- Phone
- +86 21 38954800
Official source ↗Source checked
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