Synapse Si / ZF 300 mm hybrid bonding with pre-anneal rework

Tokyo Electron · Process equipment and thermal control

Purpose: Permanent wafer bonding needs controlled surfaces, alignment and inspection. Pre-anneal defects may warrant assessment of a rework route.
Technical approach: Synapse Si supports fusion/Cu hybrid bonding with cleaning, plasma, alignment and bonding modules. ZF debonds already-bonded wafers for pre-anneal rework.
Scope of use: For 300 mm wafer-to-wafer 3D integration, including image-sensor, memory and logic applications; validate surfaces/processes.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Pre-anneal rework does not guarantee recovery of every void or alignment defect. Confirm eligible bond states, surfaces and rework cycles. Cleaning specifications for Z Plus are not evidence of ZF capabilities.
What to prepare
BLNKK suggests preparing wafer size, bow/TTV, surface/Cu topography, cleanliness, process/inspection and pre-anneal acceptance criteria.
Confirm with the supplier
Confirm configurations, surface/alignment conditions, rework eligibility, post-debond processing/rebonding and sample validation.
Public evidence: TEL describes Si production adoption and explicitly limits ZF rework to after bonding, before anneal. Its 2026 catalog was published December 2025.

Supporting references

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