Discovery DMA 850 solid-package-material viscoelastic characterization
TA Instruments · Engineering measurement and characterization
- Purpose
- Characterize cured packaging polymers across temperature and time scales for warpage-model inputs.
- Technical approach
- Dynamic/static specimen deformation measures modulus and loss through temperature/frequency sweeps, creep and stress relaxation.
- Scope of use
- Representative EMC, underfill or substrate coupons need suitable clamps and environmental configurations.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCoupon testing does not directly measure package warpage or interface adhesion. Validate shifting and model assumptions before applying TTS to the material.
What to prepareBLNKK suggests preparing grades, cure/moisture history, geometry and orientation, plus temperature, frequency and linear-viscoelastic strain plans.
Confirm with the supplierConfirm fixtures, calibration, temperature/humidity options, raw-data export and validation of the model’s modulus, relaxation or TTS inputs.
- Public evidence
- The product page and July 2024 brochure document deformation modes, TRIOS analysis and TTS.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.